Non-silicone thermal putty is a non silicon based thermally conductive putty, suitable for used as thermal interface material for electronic devices. It has higher extrusion rate, low bleed and non flow. It is designed for very good thermal conduction.
Product Code |
Special Features |
Appearance |
Viscosity (cP) |
Thermal Conductivity (W/mK))TH235-2 | Non-silicon thermal putty | Light blue | 245,000 | 4.0
