The chip-on-board epoxy has excellent thermo-mechanical properties and adhesion strength that provides maximum protection to the components, ICs and bonded wires. Dam and fill epoxy is suitable for encapsulation of bigger components and ICs.
Product Code |
Special Features |
Appearance |
Cure (˚C/ Time) |
Mixed Viscosity(cP at 25°C) |
Shelf Life(month) |
Tg (˚C) EN453 | Clear COB good for visual inspection | White paste | 2 hours at 125°C | 32,000 | 6 | 125
EN458 | Clear COB good for visual inspection | White paste | 1 hour at 120°C or 30 minutes at 150°C | 220,000 | 12 | 125
EN485 | Good protection for IC and electronic components | Black paste | 2 hours at 120°C or 1 hour at 150°C | 52,050 | 6 | 140
EN525 | Good protection for IC and electronic components | Black paste | 1 hour at 120°C or 30 minutes at 150°C | 30,820 | 12 | 152
EN641 | Good protection for IC and electronic components | Black paste | 1 hour at 100°C or30 minutes at 120°C | 30,000 | 9 | 112
EN690 | Good weatherability | Black paste | 1 hour at 100°C | 23,850 | 6 | 111
EN943-19 | Excellent UV and Heat resistantSealant for automotive LED and electronic devices | Black viscous liquid | 30 minutes at 150°C | 4,800 | 6 | NA
PT300 | 2-Part casting epoxyIdeal for casting of components for Failure Analysis | Clear +clear yellow liquid | 2 hour at 25°C | 1,700 | 12 | 80
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