The underfill epoxy is designed with good flow and capillary properties that can fill the area between the die and the carrier. Once cured, it helps to absorb the stress exerted on the solder bumps. It gives strong adhesion and improves the mechanical integrity to ensure long term reliability.
Product Code |
Special Features |
Appearance |
Cure (˚C/ Time) |
Viscosity (cP) |
Shelf Life(month) |
Tg (˚C)UF256 | Fast cure, Low CTE | Off white | 5 minutes at 150°C or 10 minutes at 130°C | 800 | 6 | 102
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