SMT Epoxy / Die Attach

The SMT epoxy is designed for high speed dispensing with good green strength to hold components in the bond pads. The viscosity and thixotropy are optimized with no bleeding and tailing.

Product Code | Special Features | Appearance | Cure (˚C/ Time) | Viscosity (cP) | Shelf Life
(month)
| Tg (˚C)
 CB643 | High speed dispensingFast cure with reflow oven | Red paste | 90 seconds at 150°C or 300 seconds at 115°C  | 30,000 * | 12 | 120
 CB644 | High speed dispensingFast cure with reflow oven | Black paste | 5 minutes at 150°C or 20 minutes at 120°C or 30 minutes at 100°C | 5,500,000 ** | 6 | 131
CB648 | High speed dispensingFast cure with reflow oven | Red paste | 90 seconds at 150°C or 2 hours at 80°C  | 5,000,000 ** | 12 | 135
CB651 | High speed dispensingFast cure with reflow oven | Red paste | 5 minutes at 150°C or 20 minutes at 120°C or 30 minutes at 100°C | 6,000,000 ** | 12 | 124