The silver die attach has been designed for auto dispensing, stamping and screen printing with excellent adhesion on various substrates such as copper and gold. Besides the electrical conductivity, it has excellent thermal conductivity which makes it suitable for bonding components that generate heat.
Product Code |
Special Features |
Appearance |
Cure (˚C/ Time) |
Viscosity (cP) |
Shelf Life (month)AG803 | Good adhesion strength, High Tg | Silver paste | 2 hours at 120°C or
1 hour at 150°C or
30 minutes at 170°C | 25,000 | 12
AG806 | Good adhesion strength ,High Tg | Silver paste | 2 hours at 120°C or
1 hour at 150°C | 65,000 | 9
AG830-12 | Low curing temperature (80-100°C), Low stress | Silver paste | 1 hour at 90°C | 3,200 | 3 hour
DA620 | Good adhesion, Good for transparent die attached., Good UV and Heat Resistance ,Suitable for stamping and dispensing process | Translucent liquid | 2 hours at 120°C or
1 hour at 150°C | 7,500 | 6
DA669 | Fast cure ,Low stress | Clear liquid | 13 minutes (Gel time) &
2 hours (Cure Time) at 120°C or
2 minutes (Gel time) &
1 hours (Cure Time) at 150°C. | 1,000 | 6
DA669-2 | Good adhesion, Good for transparent die attached. ,Suitable for stamping and dispensing process | Translucent liquid | 2 hours at 120°C or
1 hour at 150°C | 7,500 | 6
.jpg)
