The epoxy sealant is ideal for bonding and sealing various types of electronic devices such as relays, transformers and fiber optic components. It can be used to bond different types of substrates such as metal, plastic, glass and composite materials.

Product Code | Special Features | Appearance | Cure (˚C/ Time) | Viscosity (cP) | Shelf Life
(month) | Tg (˚C)
GL172 | Fast cure, Low stress | Dark blue liquid | 24 hours at 25°C or 30 minutes at 70°C | 21,040 | 12 | 70
GL174 | Fast cure, Low stress | Black paste | 24 hours at 25°C or 3 hours at 80°C | 3,500 | 3 | 60
GL440 | Good adhesion strength on wide range of substrates, Superior physical and mechanical properties after cured | Clear +yellowish liquid | 15 minutes (Gel time) & 2 hours (Cure Time) at 80°C or 6 minutes (Gel time) & 1 hours (Cure Time) at 120°C | 1,040 | 12 | 65
GL506 | Good adhesion strength on wide range of substrates, Superior physical and mechanical properties after cured | Clear +yellowish liquid | 24 hours at 25°C or 2 hours at 80°C | 32,700 | 12 | 90
GL614-4 | Good structural epoxy with no flow, Low shrinkage during cure, Good adhesion to ultem and PCB, Pass 2000 hours damp heat at 85°C/ 85% RH , Pass 100 cycles thermal shock at -40°C to 85°C, Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak | White paste | 12 minutes (Gel time) & 2 hours (Cure Time) at 100°C or 2 minutes (Gel time) & 30 minutes (Cure Time) at 150°C | 42,000 | 6 | 121
GL616 | Good structural epoxy with no flow, Low shrinkage during cure, Good adhesion to ultem and PCB, Pass 2000 hours damp heat at 85°C/ 85% RH, Pass 100 cycles thermal shock at -40°C to 85°C, Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak | White paste | 12 minutes (Gel time) & 2 hours (Cure Time) at 100°C or 2 minutes (Gel time) & 30 minutes (Cure Time) at 150°C | 24,000 | 12 | 122
GL902-4 | Ideal replacement for gasket | Green | 24 hours at 25°C | 7,500 | 12 | NA